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Sonatest XEO Phased Array Flaw Detector

The Sonatest XEO instrument combines the latest phased‑array ultrasonic testing (PA‑UT) innovation with advanced portable computing technology, redefining performance standards in the ultrasonic non‑destructive testing market.

 

Description

Overview

The Sonatest XEO redefines portable Phased Array Ultrasonic Testing (PAUT) by providing the raw computing capability of an advanced benchtop system inside a highly rugged, field-ready instrument. Built on three core pillars Simplicity, Capability, and Reliability the XEO leverages high-speed hardware data processing alongside an ultra-intuitive wizard-guided interface.

Designed to accommodate the future of NDT, it features an open data file format (.ONDE) ready for AI integration and system automation, along with a robust remote API for streamlined workflow synchronization. Whether navigating intricate T-joints, pipelines, or flat plates, the XEO ensures non-destructive testing specialists can validate configurations and capture flaw characteristics instantly and confidently.

Key Features

Simultaneous Multi-Technique Scanning

Simultaneous Multi-Technique Scanning:

Optimize your probability of detection (POD) by running up to 10 PAUT scans, up to 4 TOFD scans, and up to 8 TFM/TFMi™ scans simultaneously within the exact same setup configuration.


Ultra-High Resolution TFM Imaging

Ultra-High Resolution TFM Imaging:

Capture exceptional defect profile fidelity with live imaging speeds across 16 built-in TFM propagation algorithms, delivering crystal-clear scans up to 4 megapixels per image via Sparse Matrix Capture (SMC) hardware acceleration.


Live Onboard 3D Ray Tracing

Live Onboard 3D Ray Tracing:

Ensure maximum physical inspection coverage with interactive, true geometry 3D live rendering for sectorial and linear scanning directly on-screen.


Interchangeable Mini-Dock Architecture

Interchangeable Mini-Dock Architecture:

Smart-detection interchangeable mini-docks adapt to custom configurations, letting you swap hardware-level channel interfaces seamlessly in the field.


Intensive Touchscreen Guided UI:

Features a native wizard structure that streamlines part selection (Flat, Pipe, Rod, Curved, Corner, T-Joint) and weld joint profiles, reducing training cycles and configuration bottlenecks.

Open System & Connected Multi-Tasking:

Powered by a built-in multi-task file browser capable of directly loading project PDFs, validation images, and audio notes. Natively exports report data, indication tables, and C-scans straight to open formats like CSV.

Technical Specs

Feature Specification
Operating System Connected PAUT-TFM Linux KDE Plasma OS
Processing Memory (RAM) 32 GB
Internal Storage 500 GB Industrial Grade SSD PCIe (Speeds up to 4 GB/s; no file size limit)
Instrument Display 11.56″ Diagonal Widescreen (1920 x 1080) LED Backlight, Projective Capacitive Touch Panel
(Supports duplicated and extended display layouts)
Ultrasonic Pulsers/Receivers 64:128PR standard hardware configuration (32:128PR version available)
Max Pulse Rate Frequency (PRF) 50,000 Hz
Sampling Frequency Up to 250 MHz @ 16-bit processing
System Bandwidth 0.2 MHz to 24 MHz
Gain Range 80 dB
Data Resolution Up to 0.01° for Phased Array; up to 0.1 mm for TFM/TFMi resolution
Focal Laws Capacity Up to 16,384 focal law beams
Communication & I/O Ports
  • Wi-Fi 6 (802.11ax dual-band 2.4 GHz and 5 GHz)
  • Ethernet port
  • 2 x 10 GB/s USB-C ports with Power Delivery and DisplayPort Alternate Mode
  • 16-pin LEMO 1K (3-axis encoder input)
  • Integrated speaker
Power Input & Battery
  • Dual hot-swappable 99.4 Wh Li-Ion batteries providing >5 hours of continuous operation
  • AC 110 V / 240 V @ 50 Hz / 60 Hz via USB-C 100 W (20 V) input
Environmental Rating Certified IP65 and MIL-STD 810H vibration tested rugged housing
Operating Temperature
  • Operating: -10°C to 45°C (14°F to 113°F)
  • Storage: -20°C to 60°C (-4°F to 140°F)
Weight 5.2 kg (11.2 lbs) including batteries
Compliance Standards ISO 18563-1:2022 and ISO 22232-1:2020 certified

Industries

The multi-technique precision, robust structural ruggedness, and dynamic TFM modeling capabilities of the XEO make it ideally suited for demanding environments across:

Oil, Gas & Petrochemical:
Volumetric pipeline girth weld profiling, corrosion mapping, flange examinations, and heavy-wall pressure vessel assessments.

Power Generation & Nuclear:
Component health monitoring, complex geometry nozzle evaluations, turbine blade roots, and high-integrity structural weld mapping.

Manufacturing, Construction & Infrastructure:
Testing flat structural plates, structural corner joints, critical bridge elements, and structural T-joints using live 3D tracing verification.

Aerospace & Transport:
Composite skin inspection, component profiling, high-resolution forgings characterization, and asset structural integrity evaluations.

What’s in the Box

Sonatest XEO Box Contents

Standard configurations vary by custom selection; hardware mini-dock options specified upon build ordering.

  • Sonatest XEO High-End Portable Base Unit
  • 2 x High-Capacity 99.4 Wh Hot-Swappable Li-Ion Batteries
  • Heavy-Duty 100W USB-C AC Power Supply Adapter and Regional Cable
  • Smart-Detection Interchangeable Mini-Dock (Selected Option):
    • Option A: Dual I-PEX mini-dock (64:64 channels) + 6x UT Lemo 00 connectors
    • Option B: Single I-PEX mini-dock (128 elements) + 8x UT Lemo 00 connectors
  • Protective Transport / Rugged Carrying Case
  • Quick-Start User Manual and Calibration Certificate (ISO 18563-1 / ISO 22232-1)

**Errors and omissions excepted (E&OE)

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